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        Your present location:Homesilicone productsProductsSS Silicone > SS-3045 1-Part Heat Cure High Strength Adhesive Sealant
        • Product Name: SS-3045 1-Part Heat Cure High Strength Adhesive Sealant
        • Product No.: SS-3045
        • Brand: Silicone Solutions
        • Product Usage:
        • Commodity price:
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        Product Description

         SS-3045 is a heat curing, high strength silicone adhesive rubber developed for applications requiring fast development of physical properties and excellent adhesion. SS-3045 is a 1-part silicone that that when applied to the substrate and thermally cured allows handling of the bonded assembly within minutes. SS-3045 works well in manual and automatic dispensing equipment.

        Product Features

        1.Fast heat cure

        2.Thixotropic Paste

        3.Excellent Unprimed Adhesion to Metals and Glass 

        4.Temperature range –45 to 260℃

        Typical Applications

        1. Assembly Line Adhesive

        2. Form in place gaskets

        3. Adhesive Sealant

        Packaging

           SS-3045 is available in 10.3 oz. cartridges, 40 lb. pails and 400 lb. drums. This product is also available in customer defined packaging upon request.

        Shelf-life

           Sealed containers are guaranteed for 12 months from the ship date when stored in a freezer below 30 F.

        Typical Properties:

        UNCURED 

         

        Specific Gravity              

        1.08

        Color                  

        translucent

        Viscosity             

        500,000 cps

        Consistency       

        thixotropic paste

        Tack Free Time @ 150C  

        15 minutes

        Working time, mins @ R.T.: 

        > 7 days

        Application Rate, 90PSI , g/min: 

        250

        CURED 15 min @ 150C   

         

        Tensile Strength, PSI           

        600

        Elongation, %                 

        450

        Durometer, Shore A            

         30

        Dielectric Constant             

        2.8

        Dielectric Strength,V/mil      

        >500

        Volume Resistivity         

        2.0X1014

        Dissipation Factor            

        0.001

        Thermal conductivity       

         0.0005   

        Coefficient of Thermal Expansion  

        20 x 10-5

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