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        Your present location:Homesilicone productsProductsEncapsulant Potting Silicone Rubber > Addition electronic potting compound
        • Product Name: Addition electronic potting compound
        • Product No.: HY-9045
        • Brand: Hong Ye silicone rubber
        • Product Usage: Insulation, waterproof and bonding of general electronic components.
        • Commodity price:
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        ADDITION ELECTRONIC POTTING COMPOUND DESCRIPTION:

              Addition electronic potting compound is a kind of two components (1:1mixing ratio) addition cure silicone with the Characteristics of heat-conducting, low viscosity, Inherent flame resistance, waterproofing, etc. It can cure both at room temperature and heated temperature and the curing time can be accelerated by higher temperature.

         

        ADDITION ELECTRONIC POTTING COMPOUND APPLICATION:

               • Applying for the surface of PC (Poly-carbonate), PP, ABS, PVC, Metal, etc.
               • High powered electronic encapsulation and DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
               • Insulation, waterproof and bonding of general electronic components.
               • Filling for LED, LCD electronic display, circuit board, PCB substrate, etc.
               • Outdoor protection for LED screen.

         

        ADDITION ELECTRONIC POTTING COMPOUND NOTES AND OPERATION INSTRUCTIONS:
               1) The following material may hinder the curing of electronic potting compound silicone, so please use after the test. When necessary, please clean the application areas.
               - Organotin compound or Condensation silicone with organotin
               - Sulphur, sulfide and sulfur rubber materials.
               - Amine compounds as well as contains the amine materials.
               - Pewters solder flux
               2) Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.
               3) Please note that the thickness of the silicone affects the curing time. If the silicone used is a little thick, then the curing time will be a little longer. The temperature also affects the curing time. When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.
               4) Above electronic potting compound silicone should be sealed storage. The mixture should be used up to avoid causing waste.
               5) Above silicone belongs to non-dangerous goods, but keep away from mouth and eyes.

               6) When it gets stratified after a period of storage, please mix it evenly before using, this does not affect the performance.

         

        ADDITION ELECTRONIC POTTING COMPOUND PACKAGING:
               Standard packing for addition electronic potting compound is 22kg/set (Part A 20kg + Part B 20kg)

         

        ADDITION ELECTRONIC POTTING COMPOUND SHELF LIFE AND TRANSPORTATION:

        1. Twelve(12) months from date of shipment when stored at 24C in original unopened packages.
        2. This kind of product is non-dangerous product, it can be transported as general chemicals.
        3. Products exceed the storage life should be confirmed normal before using.

         

           If you have any interest or need more information, welcome to contact now:

          Hotline: 86-755-89948019   

                       86-755-89948006

                       86-755-89948294       

         

         

          E-mail: info@szrl.net              Skype:taylordl828

         

        ADDITION ELECTRONIC POTTING COMPOUND STANDARD DATASHEET:

        Product Model

        HY-9045

        Properties index

        Part A

        Part B

        Appearance

        Gray fluid

        White fluid

        Before curing

        Mixed Viscosity(mPa.s

        2500±500

        Features

        operation

        Mix Ratio(A:B

        1:1

        Operating Time(25℃ /mins

        60~120

        Curing time(hrs,25℃)

        8

        Curing time(hrs,80℃)

        20

        Hardness (shore A)

        45±5

         

        After Curing

        Linear expansibility[m/(m·K)]

        ≤2.2×10-4

        Thermal Conductivity[W(m·K)]

        ≥0.8

        Dielectric Strength(kV/mm

        ≥25

        Dielectric permittivity(1.2MHz

        3.0~3.3

        Volume resistivity(Ω·cm

        ≥1.0×1016

        Fire Resistance

        UL94-V1