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Two Component Silicone Potting Compound for Transformer and

Product No:HY-9300
Brand:Hong Ye Silicone
Product Usage:Hong Ye Silicone HY-9 Series is a two-component addition-cure potting compound engineered for transformer encapsulation, power supply module protection and industrial electronics sealing. Its low viscosity and self-adhesive formula ensure complete void-free filling around coil windings and complex internal structures.

Key Features

•Self-Adhesive Without Primer: Bonds directly to metal cores, coil windings, PCB substrates and plastic housings, eliminating primer processing steps
•Ultra-Low Viscosity: Penetrates deep into coil gaps and tight spaces around transformer windings for thorough encapsulation
•High Dielectric Strength: 25 kV/mm minimum provides reliable insulation for high-voltage transformer applications
•Thermal Management: Thermal conductivity 0.2 W/(m.K) minimum helps dissipate heat generated by power components
•1:1 Simple Mixing: Weight-based ratio reduces measurement errors and ensures consistent curing quality
•Flexible Cure Schedule: Room temperature 8 hours or rapid heat cure 20 minutes at 80C to match production pace
•UL94 V-1 Flame Retardant: Meets international safety requirements for power and industrial electronics
•Wide Temperature Range: Performs from -50C to 200C, suitable for automotive and outdoor power equipment
Available Models
 
Model | Hardness | Viscosity (cps) | Best For
HY-9300 | 0 | 600-1000 | Transformer coil potting, transparent encapsulation where visual inspection is needed
HY-9400 | Below 0 | 680-1400 | Deep layer potting of large power modules, maximum shock absorption
HY-9405 | 5±2 | 600-1000 | General power supply potting, slightly firmer gel for structural support
 
Custom formulations available for hardness, viscosity, curing speed and color adjustments.
 
How to Use
1.Stir component A and B separately before mixing
2.Weigh A and B at 1:1 by weight
3.Mix thoroughly until fully homogeneous
4.Vacuum degas at -0.08 MPa for 3-5 minutes
5.Pour slowly into transformer or module housing
6.Cure at room temperature or accelerate with heat at 80-100C

Applications
•Transformer and inductor potting and insulation
•Switching power supply module encapsulation
•Adapter and charger potting protection
•Inverter and converter sealing
•Industrial controller moisture-proof potting
•Automotive electronic control unit encapsulation
•LED driver potting and waterproof protection
•Sensor and probe potting for harsh environments

Packing and Delivery
•Standard: 20kg/set (Component A 10kg + Component B 10kg)
•Sample: 1kg available for testing
•Bulk: 200kg drum available
•Non-dangerous goods for easy shipping
•Store at 25C or below, shelf life 12 months

FAQ
 
Q: Can this potting compound withstand high voltage?
A: Yes. The dielectric strength reaches 25 kV/mm minimum, providing reliable insulation for high-voltage transformer and power module applications.
 
Q: How do I handle air trapped in transformer windings?
A: After mixing, vacuum degas at -0.08 MPa for 3-5 minutes before pouring. The low viscosity helps the silicone flow into coil gaps and release trapped air naturally.
 
Q: What if I need faster curing for mass production?
A: Heat cure at 80-100C reduces curing time to approximately 20 minutes, ideal for high-volume production lines.

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