HONG YE SILICONE’s Essential Electronic Potting Silicone is a cost-effective fundamental protective encapsulation material and practicalcore module potting compound. As a classic basic circuit sealing silicone, it delivers essential and reliable protection for general electronic components. It features wide temperature tolerance from -60℃ to 220℃ and stable insulation performance. It enriches our full product lineup including standardElectronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
Product Overview
This two-component essential-grade silicone potting material includes addition and condensation curing formulas, serving as the most fundamental encapsulation solution for mainstream electronic manufacturing. After mixing with curing agents, the liquid colloid cures firmly to complete encapsulation, sealing, filling and pressure resistance protection for electronic parts. It boasts excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, integrating waterproof, dustproof, insulating and heat-dissipating core functions.
Technical Specifications
This basic circuit sealing silicone adopts low-volatility and high-strength formula. It resists corrosion, ozone and chemical erosion effectively, and absorbs internal thermal stress caused by high-temperature cycling to protect chips and gold bonding wires. It maintains stable performance in extreme temperature environments and forms durable bonding on aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support personalized adjustment.
Product Features & Advantages
1. Fundamental All-Round Protection: This fundamental protective encapsulation material covers core electronic protection needs including waterproofing, insulation, shockproof and temperature resistance.
2. Universal Module Adaptability: The core module potting compound fits most common electronic modules and substrate materials with stable sealing effects.
3. Stable Extreme Temperature Performance: It operates continuously at -60℃ to 220℃, relieving thermal expansion and contraction damage to electronic components.
4. High Cost-Performance: With simple operation and low impurity content, it reduces production costs while ensuring long-term stable circuit operation.
Step-by-Step Usage Process
1. Pre-Mixing Preparation: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming for bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applicable for encapsulation and sealing of civilian electronics, LED modules and ordinary industrial control components. This basic circuit sealing silicone standardizes electronic protection procedures, effectively reduces circuit failure rates, simplifies material selection for mass production, and cuts long-term procurement and maintenance costs for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental requirements.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to match diverse basic electronic encapsulation processes.
Production Process
Manufactured with standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of fundamental protective encapsulation material delivers consistent reliable quality.
FAQ
Q1: What is the positioning of Essential Electronic Potting Silicone?
A: It is a high-cost-performance core module potting compound, specially designed for mass
basic electronic encapsulation scenarios.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Uniform stirring before use can completely restore its original sealing and protective
performance without quality loss.
Q3: Is it suitable for multi-substrate electronic devices?
A: Absolutely. This basic circuit sealing silicone has excellent compatibility with mainstream
plastics and metal substrates for wide versatile applications.
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