Product Overview
Available in addition and condensation curing types, this safety-grade Electronic potting compound focuses on fireproof encapsulation, sealing and pressure-resistant filling for electronic components. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel. Cured colloid absorbs thermal cycling stress, protects chips and bonding wires, and avoids combustion failure of circuit modules under extreme temperature conditions.
Technical Specifications
Formulated with eco-friendly flame-retardant fillers, this fire retardant encapsulation material features low volatile content, outstanding ozone and chemical corrosion resistance. It retains stable heat dissipation performance same as our classic Thermally Conductive Potting Compound. Viscosity, hardness and curing time are customizable to meet strict UL recognized module potting and self extinguishing circuit protection standards.
Product Features & Advantages
This fireproof silicone outperforms ordinary insulating Silicone Encapsulant in safety protection performance:
1. Premium Flame Retardancy: Adopts professional fire retardant encapsulation material formula with automatic fire extinguishing function to block fire spread.
2. UL Standard Compliance: Realize standardized UL recognized module potting to meet international electronic safety certification requirements.
3. Reliable Circuit Safety: Provide all-round self extinguishing circuit protection to reduce equipment fire risks caused by short circuit and overheating.
4. Multi-Functional Protection: Integrate waterproof, dustproof, insulation and wide temperature resistance for long-term stable safe operation.
Application Scenarios
As a safety-certified Electronic Encapsulation Adhesive, it is widely used for power supply modules, new energy electronics, industrial control equipment and household electrical devices. It effectively lowers electronic fire failure rates, improves product safety grades and helps buyers meet international safety compliance standards.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to uniformly disperse flame-retardant functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable flame retardant and curing performance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless safe encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; stable environment guarantees optimal fireproof protection effect.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE, RoHS and UL safety certifications. This flame resistant potting compound fully complies with global electronic fire safety standards.
Customization Options
We provide personalized parameter customization. Clients can adjust viscosity, hardness and flame retardant grade to develop exclusive safety encapsulation solutions.
Production Process
We adopt dust-free standardized production and strict flame retardant testing. Every batch is verified for fireproof performance to ensure qualified UL recognized module potting quality.
FAQ
Q1: What is the core advantage of this product?
A: It is a high-standard fire retardant encapsulation material with UL recognized module potting capability,
providing durable self extinguishing circuit protection for electronic modules.
Q2: Will colloidal stratification affect flame retardant performance?
A: Stratification is a normal storage feature. Stir evenly before use, and its fireproof and protective performance
remain unchanged.
Q3: Is it suitable for new energy electronic safety encapsulation?
A: Yes. Its excellent flame retardancy and safety compliance fully meet high safety requirements of new
energy electronic equipment.
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