Product Overview
Available in addition and condensation curing formulas, this high-rigidity Electronic potting compound specializes in encapsulation, sealing and pressure-resistant filling of precision electronic components. It serves as a high-performanceElectronic Encapsulation Adhesive with excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. It absorbs thermal cycling stress and delivers lasting structural stability to avoid circuit deformation failure.
Technical Specifications
Formulated with anti-creep molecular structure, this advanced Silicone Encapsulant acts as a stable load bearing module potting material. It features low volatility, outstanding ozone and chemical erosion resistance, retaining stable heat dissipation performance equivalent to our classicThermally Conductive Potting Compound. Viscosity, hardness and operating time are customizable for personalized deformation prevention circuit protection solutions.
Product Features & Advantages
1. Excellent Anti-Creep Performance: Realize long term dimensional stability encapsulation, resisting permanent deformation under long-term pressure and temperature changes.
2. Stable Load Bearing Capacity: As a professional load bearing module potting material, it maintains structural integrity under continuous mechanical stress.
3. Reliable Circuit Protection: Provide durable deformation prevention circuit protection to extend the service life of precision electronic modules.
4. All-Round Environmental Resistance: Integrate waterproof, insulation, dustproof and wide-temperature resistance for long-term stable operation.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to uniformly disperse anti-creep functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable structural stability and curing performance.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Curing Operation: Cure via room temperature or heating method; full curing takes 24 hours, with ambient temperature and humidity affecting curing progress.
Application Scenarios
Ideal for precision instrumentation, stacked circuit modules, high-load industrial electronics and long-service-life electrical equipment, this product delivers stable long-term protection. It reduces deformation-related failure rates, lowers maintenance costs and improves product durability for global electronic manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global precision electronic manufacturing safety and quality specifications.
Customization Options
Customizable parameters include cured hardness, viscosity and working time to adapt to different load-bearing and long-term operation scenarios.
Production Process
We adopt dust-free standardized production and strict anti-creep & dimensional stability testing to ensure every batch delivers consistent long-term encapsulation performance.
FAQ
Q1: What makes this potting compound different from ordinary silicone?
A: It is a professional creep-resistant load bearing module potting material, supporting long term dimensional
stability encapsulation and realizing effective deformation prevention circuit protection.
Q2: Will long-term high temperature cause structural deformation?
A: No. Its unique anti-creep formula maintains stable structure and size under continuous high temperature
and thermal cycling working conditions.
Q3: Does colloidal stratification affect anti-creep performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the product’s dimensional stability
and protective performance remain unchanged.
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