Product Overview
Available in addition and condensation curing types, this dimension-stable Electronic potting compound focuses on precision encapsulation and sealing of high-accuracy electronic parts. As a reliable Electronic Encapsulation Adhesive, it offers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal materials. It effectively releases internal thermal stress and protects delicate chips and bonding wires from thermal cycle damage.
Technical Specifications
Formulated with low-shrinkage molecular structure, this high-precision Silicone Encapsulant realizes ideal coefficient matched protective encapsulation. It features low volatility, outstanding chemical and ozone resistance, and retains stable heat dissipation performance like our classic Thermally Conductive Potting Compound. Viscosity, hardness and operating time are customizable for exclusive thermally stable dimension module potting solutions.
Product Features & Advantages
1. Ultra-Low Thermal Expansion: Achieve precise coefficient matched protective encapsulation to avoid expansion extrusion and shrinkage cracking.
2. Dimensional Stability: Professional thermally stable dimension module potting ensures zero deformation under repeated high and low temperature cycles.
3. Stress Reduction Performance: Provide efficient thermal cycle stress reduction protection to extend service life of precision electronic components.
4. Comprehensive Protection: Integrate insulation, waterproof, dustproof and shockproof properties with strong bonding strength for diverse substrates.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to disperse low-expansion functional fillers uniformly.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable dimensional stability after curing.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient conditions affect curing uniformity.
Application Scenarios
This low thermal expansion silicone is widely used for precision sensors, automotive electronic modules, industrial control chips and high-precision communication devices. It reduces thermal deformation failure rates, improves product precision consistency and cuts long-term maintenance costs for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global precision electronic encapsulation quality and safety specifications.
Customization Options
We support personalized customization of hardness, viscosity and thermal expansion coefficient to fit diverse precision temperature-cycle working scenarios.
Production Process
We adopt dust-free standardized production and strict thermal cycle testing. Every batch is verified for dimensional stability to guarantee reliable thermal cycle stress reduction protection.
FAQ
Q1: What is the core advantage of this potting silicone?
A: It features coefficient matched protective encapsulation and thermally stable dimension module potting,
providing professional thermal cycle stress reduction protection for precision electronics.
Q2: Will long-term temperature cycles cause encapsulation peeling?
A: No. Its low expansion formula matches substrate deformation, effectively buffering thermal stress without
delamination or cracking.
Q3: Does colloidal stratification affect dimensional stability?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its low thermal expansion and
protective performance remain unchanged.
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