Product Overview
Available in addition and condensation curing formulas, this high-efficiency Electronic potting compound specializes in encapsulation, sealing and gap filling for high-power heating components. It boasts excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Cured silicone works steadily at -60℃ to 220℃, absorbs thermal expansion and contraction stress, and fully protects delicate wafers and bonding wires without squeezing or damaging precision components.
Technical Specifications
Formulated with high-purity thermal conductive fillers, this heat dissipating stress relieved encapsulation material achieves outstanding heat transfer efficiency. It features low volatile content, excellent ozone resistance and chemical corrosion resistance. As an upgraded version of conventional Thermally Conductive Potting Compound, it optimizes flexible molecular structure to reduce internal curing stress. Viscosity, hardness and thermal conductivity can be customized for diversified thermal management module demands.
Product Features & Advantages
This low-stress thermally conductive silicone outperforms ordinary potting materials for high-power precision electronics:
1. Efficient Heat Dissipation: Realize professional heat dissipating stress relieved encapsulation to rapidly export internal heat and avoid equipment overheating.
2. Ultra-Low Stress Buffer: Adopt flexible formula to eliminate curing shrinkage stress, realizing safe thermal management module packaging.
3. Temperature Control Protection: Provide stable junction temperature reduction protection to extend the service life of high-power electronic components.
4. Multi-Dimensional Protection: Integrate insulation, waterproof, shockproof and high-low temperature resistance to adapt complex operating environments.
Application Scenarios
As a high-performance Electronic Encapsulation Adhesive, this product is widely used for CPU modules, power supply units, new energy electronic components and high-power LED modules. It greatly reduces thermal failure rates, serving as an ideal upgraded alternative to rigid high-heat Silicone Encapsulant.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A to evenly disperse thermal conductive fillers and shake Part B thoroughly for uniform mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable thermal conductivity and low-stress performance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before perfusion.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; stable environment ensures optimal stress-relief and heat dissipation performance.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This low-stress thermal conductive potting silicone meets global high-power electronic manufacturing specifications.
Customization Options
We provide personalized customization. Clients can adjust viscosity, cured hardness and thermal conductivity to create exclusive junction temperature reduction protection encapsulation solutions.
Production Process
We adopt dust-free standardized production and dual performance testing. Every batch undergoes thermal conductivity and stress detection to ensure qualified heat dissipating stress relieved encapsulation and reliable thermal management module performance.
FAQ
Q1: What is the core advantage over ordinary thermally conductive silicone?
A: It realizes heat dissipating stress relieved encapsulation, supports precise thermal management module
control, and provides effective junction temperature reduction protection without component stress damage.
Q2: Will colloid stratification affect heat dissipation performance?
A: Stratification is a normal storage feature. Stir evenly before use, and its thermal conductivity and low-stress
characteristics remain unchanged.
Q3: Is it suitable for fragile high-precision chip packaging?
A: Yes. Its ultra-low stress formula avoids extrusion damage to chips, perfectly fitting high-power and precision
electronic module encapsulation.
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