HONG YE SILICONE’s Standard Electronic Potting Silicone Compound is a cost-effective basic level protective encapsulation material and practical conventional module potting compound. As a classic regular circuit sealing silicone, it provides stable basic protection for general electronic components. It features wide temperature adaptability from -60℃ to 220℃ with excellent insulation and environmental resistance. It complements our full product line, including professional Electronic potting compound, heat-dissipating Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrialSilicone Encapsulant.
Product Overview
This two-component standard silicone potting material includes addition and condensation curing types, serving as a mainstream basic encapsulation solution for general electronics. After mixing with curing agents, the liquid colloid cures into a solid protective layer, delivering waterproof, moisture-proof, flame-retardant and insulating protection for electronic devices. It offers superior adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates, ideal for daily electronic sealing and filling demands.
Technical Specifications
This regular circuit sealing silicone adopts low-volatility, high-strength formula. It resists corrosion, ozone and chemical erosion, and can absorb internal thermal stress caused by high-temperature cycling to protect chips and gold bonding wires. It maintains stable performance in -60℃ to 220℃ extreme environments, with outstanding bonding strength for aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support personalized adjustment.
Product Features & Advantages
1. Stable Basic Protection: This basic level protective encapsulation material integrates waterproof, dustproof, shockproof and insulating functions to meet daily electronic protection needs.
2. Universal Compatibility: The conventional module potting compound fits most common electronic substrates and metal materials with excellent sealing performance.
3. Strong Temperature Adaptability: It relieves thermal expansion and contraction stress effectively, avoiding component damage from frequent temperature changes.
4. High Cost-Performance: With low volatile content and stable curing effect, it reduces production costs while ensuring long-term circuit stability.
Step-by-Step Usage Process
1. Preprocessing: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before operation.
2. Accurate Proportioning: Mix A and B components strictly according to standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Place the mixed compound in a 0.01MPa vacuum container for 3 minutes of defoaming for bubble-free pouring.
4. Curing Treatment: Cure at room temperature or heated condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applied for encapsulation, sealing, filling and pressure resistance of consumer electronics, LED modules and ordinary industrial control components. This conventional module potting compound reduces circuit failure rates caused by harsh environments, improves product yield, simplifies material selection for manufacturers, and lowers long-term production and maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental requirements.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to match diverse standard encapsulation processes.
Production Process
Manufactured with standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring consistent quality of every batch of regular circuit sealing silicone.
FAQ
Q1: What is the positioning of this standard potting silicone?
A: It is a cost-effective basic level protective encapsulation material designed for mass general
electronic encapsulation and daily circuit protection.
Q2: Can stratified colloid be used normally?
A: Yes. Uniform stirring before use can completely restore its original performance without affecting
sealing and protection effects.
Q3: Is it suitable for mass electronic production?
A: Absolutely. It features simple operation, stable curing and wide compatibility, perfectly adapting
to large-scale standardized electronic production.
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