Low Outgassing Two-Component Addition Silicone for High-Relia

Low Outgassing Two-Component Addition Silicone for High-Reliability Electronic Potting & Encapsulation

1. Product Upgrade Notice
    
   Ordinary two-component silicone releases volatile gas during curing, causing short circuit and surface contamination of circuit boards. This addition-type A/B silicone cures without small molecule byproducts, with ultra-low outgassing to meet high-standard electronic workshop requirements.
2. Core Performance Advantages
    
   Excellent dielectric insulation blocks electric leakage and short circuit risks. Wide temperature resistance from -60℃ to 200℃ maintains stable sealing under equipment heat generation. Strong adhesion to metal, PCB, plastic and ceramic substrates, no delamination under vibration.
3. Processing & Application Scenarios
    
   Adjustable viscosity supports automatic dispensing and manual pouring. Mainly applied to power supply modules, LED drive boards, new energy battery control units, sensor encapsulation and outdoor communication equipment sealing.
4. Industry Outlook
    
   3C electronics and new energy equipment raise higher standards for encapsulation reliability. Hongyejie supplies flame-retardant, thermal conductive two-component potting silicone for diversified electronic protection demands.