Product Overview
This high-performance electronic encapsulation adhesive includes addition-curing and condensation-curing formulas, specially optimized for mixed technology boards combining PCB, CPU, PC insulation boards and PMMA acrylic materials. It excels in multi-substrate adhesion, sealing and thermal stability, overcoming the poor compatibility of ordinary potting glue on mixed material structures. After curing, it forms a flexible protective layer that buffers thermal stress and shields internal wafers and gold bonding wires for long-term stable operation.
Core Product Features & Advantages
Tailored for mixed technology board packaging, this product offers unmatched comprehensive performance for multi-material electronic assemblies:
1. Universal multi-substrate adhesion: Firmly bonds aluminum, copper, stainless steel, PC, PMMA and PCB materials, perfectly fitting mixed tech board composite structures.
2. Full protective performance: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion, insulation and shockproof functions, with excellent ozone and chemical erosion resistance.
3. Wide temperature tolerance: Operates stably from -60℃ to 220℃, effectively relieves thermal cycling stress and prevents component damage on mixed-structure circuit boards.
4. Low volatility & high stability: Features low volatile content and high structural strength, ensuring no performance attenuation for complex mixed electronic systems.
Application Scenarios
Ideal for encapsulation, sealing, filling and pressure resistance protection of mixed technology boards with composite materials. Widely used in industrial hybrid circuit boards, intelligent control modules and multi-layer electronic assemblies. It unifies the protection of different substrate components, reduces board failure rates caused by material incompatibility, improves finished product yield and cuts manufacturers’ production and maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly for consistent performance.
2. Standard mixing: Strictly follow AB component weight ratio to ensure uniform mixing and stable compatibility for mixed substrates.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate bubbles in complex board gaps.
4. Curing operation: Adopt room temperature or heating curing. Complete curing takes 24 hours, with curing efficiency affected by ambient temperature and humidity.
Certifications & Compliance
Our silicone products pass ISO9001, CE and UL certifications and comply with ROHS environmental standards. As qualified industrial silicone raw materials, they meet global electronic safety specifications and support worldwide export trade.
Customization Options
We provide professional OEM customization. Hardness, viscosity, operating time and curing speed can be adjusted to adapt to different mixed technology board packaging processes.
Production & Quality Control
Backed by 20+ years of manufacturing experience, we implement standardized production and strict full-process QC. Pre-production sample testing and pre-shipment full inspection guarantee stable batch quality.
FAQ
Q1: Can it adapt to different mixed board materials? A: Yes. It has universal adhesion and compatibility for multiple metal and plastic substrates, suitable for all mainstream mixed technology boards.
Q2: Is stratified silicone usable for mixed board encapsulation? A: Slight stratification is normal after long storage. Even stirring will not affect adhesion and protective performance.
Q3: How to store the mixed potting silicone? A: Keep sealed storage. Mixed AB glue should be used up at one time to avoid performance degradation and waste.
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