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        Your present location:Homesilicone productsProductsEncapsulant Potting Silicone Rubber > Potting compound for electronic components
        • Product Name: Potting compound for electronic components
        • Product No.: HY-215
        • Brand: HY silicone
        • Product Usage: LED, LCD, display, automobile,general electronic module
        • Commodity price:
        • Views : 2237

         

        DESCRIPTION OF ENCAPSULANT SILICONE:(LINK)

         HY215  potting compound is a kind of condensation cure silicone in two parts with the characteristics of strong adhesion,

        excellent thermal conductivity, good moisture protection, high temperature resistance. It can be cured completely at room

        temperature. The safety of this RTV encapsulation material can reach the EU-ROHS requirements fully.

         

        USAGE OF ENCAPSULANT SILICONE:

                - Applying for the surface of PC (Poly-carbonate), PP, ABS, PV, photovoltaic cell, PVC, metal,etc.

                 -Encapsulation for protection of general electronic module, electronic components

                 -Insulation, waterproof and bonding of electronic parts

                 -Bonding, Sealing(as a sealant or adhesive) for LED, LCD electronic display, circuit board, automobile

                  component

                 -Outdoor protection for LED screen

         

         

        USING NOTE OF ENCAPSULANT SILICONE:

              1. All the data is  based on the condition of 25℃ with 55% humidity. 

               2. Sealing package for storage. The mixture should be used up at once to avoid wasting.

               3. Dot not let the liquid go into mouth and eyes when operate the potting process.

               4. When it gets stratified after a period of storage, you should mix the electronic silicone rubber evenly  before using,

        it does not affect the performance(before the expiration date).

               5. It can be stored for 12 months  at 24℃ in original unopened packages.

         

        TECHNICAL GUIDELINES OF ENCAPSULANT SILICONE:

           1. Please put part A and B in separate container and stirs evenly before mixing the two parts together.

           2. Weight Ratio: part A: part B = 10:1

           3.Bubble release if necessary, Deaeration the mixture under 0.08 MPa for 3 minutes.

           4. HY 215 is cured at room temperature, so please put it under room temperature after pouring. It comes to next process when basically cured, and it takes about 24  hours for completely cured.(Temperature and humidity will influence the curing of HY215.)

         

        PACKAGE OF ENCAPSULANT SILICONE:
        25KG/drum vacuum packing for part A +1kg/ bottle catalyst for part B
        200KG/drum packing for part A +1kg/ bottle catalyst for part B

         

        SHELF LIFE OF ENCAPSULANT SILICONE:
        1.Twelve(12) months when stored under dry and cool place by original package under 25℃

         

           If you have any interest or need more information, welcome to contact now:

          Hotline: 86-755-89948019   

                       86-755-89948006

                       86-755-89948294       

         
         

          E-mail: info@szrl.net              Skype:taylordl828

         

        TECHNICAL PARAMETER OF ENCAPSULANT SILICONE:

        Properties index

        Part A

        Part B

        Before curing

        Appearance

        Black fluid

        Yellowish fluid

        Viscosity(cps)

        2500±800

        Features when operation

        Mixing Ratio(By weight)

        10:1

        Operating Time(25℃ /min)

        60~120

        Curing time(hrs,basically cured)

        3

        Curing time(hrs,perfectly cured)

        24

        Hardness (shore A)

        15±3

         

        After Curing

        Cementability

        Very good

        Thermal Conductivity[W(m·K)]

        ≥0.4

        Dielectric Strength(kV/mm)

        ≥25

        Dielectric permittivity(1.2MHz)

        3.0~3.3

        Volume resistivity(Ω·cm)

        ≥1.0×1016

        Fire Resistance

        UL94-V0