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        • Product Name: Electronic Potting Compound Silicone
        • Product No.: HY 9325
        • Brand: HY silicone
        • Product Usage:
        • Commodity price:
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        ELECTRONIC POTTING COMPOUND SILICONE DESCRIPTION:

        HY 9325 Electronic Potting Compound Silicone is a kind of low viscosity, Inherent flame resistance, two components addition cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of  PC(Poly-carbonate)、PP、ABS、PVC, etc. and metal materials.
         

        ELECTRONIC POTTING COMPOUND SILICONE PACKAGE:

        20Kg/pail for Part A  +20Kg/pail for Part A in one set


        ELECTRONIC POTTING COMPOUND SILICONE SHELF LIFE AND TRANSPORTATION:

        1. Twelve(12) months when stored at 24C in tightly closed original packages.
        2. This kind of product is non-dangerous product, which could be transported as general chemicals.
        3. Storage beyond the expired date doesnot necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

         

           If you have any interest or need more information, welcome to contact now:

          Hotline: 86-755-89948019   

                       86-755-89948006

                       86-755-89948294       

          E-mail: info@szrl.net              Skype:taylordl828

         

        ELECTRONIC POTTING COMPOUND SILICONE TECHNICAL PARAMETERS:

        Features

        Part A

        Part B

        Before Curing

        Appearance

        Clear 

        Clear 

         

        Operation features

        Mixing Ratio

        1:1

        Viscosisty (after mixing) (cps)

        500±100

        Operating Time(25℃  mins)

        60-120

        Curing time (hours,25℃)

        8-10

        Curing time(80℃  mins)

        20

         

         

        After Curing

        Hardness(Shore  A)

        25±3

        Thermal conductivity [W(m·K)]

        ≥0.8

        Dielectric Strength(KV/mm)

        ≥25

        Permittivity(1.2MHz)

        3.0~3.3

        Volume Resisivity(Ω·cm)

        ≥1.0×1016

        linear expansibility [m/(m·K)]

        ≤2.2×10-4

        Fire Resistance   

        94-V1

        (Pls note: the above data for this product in 25 ℃ temperature, 55 percent humidity
        conditions, for reference. The accurate data is measured by customers when using.)