ELECTRONIC POTTING COMPOUND SILICONE DESCRIPTION:
HY 9325 Electronic Potting Compound Silicone is a kind of low viscosity, Inherent flame resistance, two components addition cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate)、PP、ABS、PVC, etc. and metal materials.
ELECTRONIC POTTING COMPOUND SILICONE PACKAGE:
20Kg/pail for Part A +20Kg/pail for Part A in one set
ELECTRONIC POTTING COMPOUND SILICONE SHELF LIFE AND TRANSPORTATION:
1. Twelve(12) months when stored at 24C in tightly closed original packages.
2. This kind of product is non-dangerous product, which could be transported as general chemicals.
3. Storage beyond the expired date doesnot necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
If you have any interest or need more information, welcome to contact now:
Hotline: 86-755-89948019
86-755-89948006
86-755-89948294
ELECTRONIC POTTING COMPOUND SILICONE TECHNICAL PARAMETERS:
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Features
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Part A
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Part B
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Before Curing
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Appearance
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Clear
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Clear
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Operation features
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Mixing Ratio
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1：1
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Viscosisty (after mixing) （cps）
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500±100
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Operating Time（25℃ mins）
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60-120
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Curing time （hours，25℃）
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8-10
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Curing time（80℃ mins）
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20
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After Curing
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Hardness（Shore A）
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25±3
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Thermal conductivity [W（m·K）]
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≥0.8
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Dielectric Strength（KV/mm）
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≥25
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Permittivity（1.2MHz）
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3.0～3.3
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Volume Resisivity（Ω·cm）
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≥1.0×1016
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linear expansibility [m/（m·K）]
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≤2.2×10-4
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Fire Resistance
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94-V1
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(Pls note: the above data for this product in 25 ℃ temperature, 55 percent humidity
conditions, for reference. The accurate data is measured by customers when using.)
